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Advanced electronic packaging


There are different thermal conduction materials that are used for the packaging of transistors and heat radiators, protection of pipe core, sealing of case, thermal conduction of thermistor-thermal resistor, thermal conductivity assembly of composite board in micro packaging, new high heat dissipation circuit substrate, etc. Therefor, the research and develop of the thermal conduction materials which are high in heat conductivity and insulation and excellent in mechanical property are very important.

As a new carbon nanomaterial, CNT is excellent in thermal conduction performance and mechanical property and good in electrical conductivity. It can be applied in many cutting-edge development projects, such as the super-high density integrated circuits, advanced electronic packaging equipment, weight reduction of high-precision electronics , energy saving and heat dissipation of large-scale electronic system.

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